WAFER-CLEANING AND DRYING DEVICE

Title:

WAFER-CLEANING AND DRYING DEVICE

Document Type and Number:

Japanese Patent JP2002231685

Kind Code:

A

Abstract:

To provide a wafer-cleaning and drying device for simply and easily executing manufacturing and drying processes with one device, during the manufacturing process of a semiconductor device.

The wafer-cleaning and drying device includes a cleaning zone 10 for cleaning a wafer, and a drying zone 20 that is moved horizontally by a gap rail 40, for separating and connecting the washing zone and has a spray module 22 at the upper section. The cleaning zone 10 comprises a high-flow module 12 and a one-way stream module 14 for supplying a cleaning liquid or demineralized water, and a paste drain module 16 for discharging the cleaning liquid or the demineralized water, thus cleaning and rising the wafer. Also, the dry zone 20 accommodates the vapor of a polar organic solvent supplied from the spray module 22 and an inert carrier gas for drying the wafer.

Inventors:

KIM DAIKI
KIM KEICHIN
KIM TOKUKO
AN SHOHACHI

Application Number:

JP2001046813A

Publication Date:

August 16, 2002

Filing Date:

February 22, 2001

Export Citation:

Click for automatic bibliography generation Help

Assignee:

APET CO LTD

International Classes:

F26B9/06; F26B15/12; F26B21/14; H01L21/304; (IPC1-7): H01L21/304; F26B9/06; F26B15/12; F26B21/14

Domestic Patent References:

JPH10503327A	1998-03-24
JPH0938605A	1997-02-10
JP2000208471A	2000-07-28
JPH10289895A	1998-10-27

Attorney, Agent or Firm:

Shukichi Nakagawa (1 person outside)

Previous Patent: DRYING DEVICE

Next Patent: WAFER-DRYING METHOD