PURPOSE: To prevent the generation of damage of the crack and break and so on of a wafer with a pattern and to contrive the improvement of a throughput by a method wherein the wafer is conveyed while it is abutted in advance on the sidewall of a wafer conveying speed control means.

CONSTITUTION: Air blow-off holes 4 are arranged on the surface of a conveying path 3 at prescribed intervals, a guide groove 7 for a water conveying speed control means 5 is engraved along the center line in the longitudinal direction of the path 3 and a wafer positioning stage 9 is arranged at the terminal in the progressing direction of the path 3. The central part of a wafer stop sidewall 11 of the stage 9 is notched and the means 5 is engaged with this notch part 13. As a wafer 15 is conveyed in a state that it is abutted on the sidewall of the means 5, the wafer 15 comes into contact to the sidewall 11 without being subjected to impact and is positioned immediately. Thereby, the generation of damage of the crack and break and so on of the wafer with a pattern can be prevented and the improvement of a throughput is contrived.