PURPOSE: To dispense with a readjustment of a conveying mechanism even if the sizes of wafers are modified by a method wherein the wafers are conveyed in a state that they are sucked by a vacuum sucking head from the rears of the wafers.
CONSTITUTION: A vacuum sucking head 1 is made to stand by at a position in the vicinity of a timing gear 5 on one side and when a wafer 11 is placed on the upper surface of the head 1, sensors 13 arranged at the stand-by position of the head 1 detect the wafer 11 and a vacuum suction of the wafer is started. Moreover, the drive of the gear 5 is also started and the water is made to advance toward a timing gear 5 on the other side. Sensors 15 are arranged at the position of a wafer conveying end point as well, and when these end point sensors 15 detect the wafer, the drives of the gears 5 and the vacuum suction are stopped. The wafer 11 conveyed to the end point is delivered on a wafer conveying pawl 19 having a plurality of receiving stages 17 to correspond to the sizes of wafers. Thereby, even if the sizes of the wafers are modified, there is no need to readjust a conveying mechanism.
| WO/2001/083180 | METHOD FOR WORKING GLASS SHEETS |
| JP2022096455 | WAFER GENERATION DEVICE |
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IKUMI MASUZO
NAKA TAKAYUKI
SUZUKI HIROSHI
NAKAMURA HISATO
