To provide a welding laser device which reduces manufacturing costs, shortens working hours, and improves productivity by allowing brazing bonding and laser welding for bonding two materials or panels with each other to be performed in one device.

The welding laser device includes a mounting frame, and a laser optic head mounted on a lower part of the mounting frame and formed to irradiate a laser beam on a bonding part between materials by varying a spot size of the laser beam oscillated from a laser oscillator. According to the spot size varied by the laser optic head, brazing bonding or laser welding is selectively performed. A wire feeder is further included for performing brazing bonding by supplying a filler material to the laser beam irradiated from the laser optic head and melting the same.