Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2016139775
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high density wiring board excellent in insulation reliability.SOLUTION: In a wiring board A having first insulating layers 5a, 5c, a groove 11 formed in the principal surface of the first insulating layers 5a, 5c, a wiring conductor 6 filling the groove 11, and second insulating layers 5b, 5d laminated on the principal surface so as to cover the wiring conductor 6, the surface of the wiring conductor 6, covered with the second insulating layers 5b, 5d, is located closer to the first insulating layers 5a, 5c than the interface of the first insulating layers 5a, 5c and second insulating layers 5b, 5d.SELECTED DRAWING: Figure 1
Inventors:
YASUDA MASAHARU
Application Number:
JP2015086690A
Publication Date:
August 04, 2016
Filing Date:
April 21, 2015
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K1/02; H05K3/10