Title:
減衰機構
Document Type and Number:
Japanese Patent JP7133974
Kind Code:
B2
Abstract:
To provide a damping mechanism which can deal with larger displacement.SOLUTION: A damping mechanism 1A provided between an upper part structure (a first structure) 13 and a lower part structure (a second structure) 14 which enable relative displacement has: a rotary member 3 which rotates according to an amount of relative displacement between the upper part structure 13 and the lower part structure 14; and a hydraulic motor 4 which is provided coaxially with the rotary member 3 and can transmit rotation between itself and the rotary member 3. The hydraulic motor 4 has: a connection pipe 47 which allows communication between two ports 44, 45 through which a working fluid 41 flows in or out; and a damping valve 48 provided at an interior of the connection pipe 47.SELECTED DRAWING: Figure 1
More Like This:
| WO/2008/044712 | PRESSURE REGULATOR AND VIBRATION ISOLATOR |
| WO/2004/088164 | ENGINE MOUNT |
| JP2004028130 | DAMPING DEVICE OF BULKHEAD STRUCTURE |
Inventors:
Kazuhiko Isoda
Application Number:
JP2018091645A
Publication Date:
September 09, 2022
Filing Date:
May 10, 2018
Export Citation:
Assignee:
Shimizu Construction Co., Ltd.
International Classes:
F16F15/023; E04H9/02
Domestic Patent References:
| JP1242844A | ||||
| JP2016515965A | ||||
| JP59187124A | ||||
| JP2004036677A | ||||
| JP2016211602A | ||||
| JP2016217367A | ||||
| JP5231030A | ||||
| JP2007078062A |
Attorney, Agent or Firm:
Yasushi Matsunuma
Kenichi Kawabuchi
Kazuzumi Nishizawa
Kenichi Kawabuchi
Kazuzumi Nishizawa
Previous Patent: semiconductor light emitting device
Next Patent: Etching method and etching apparatus
Next Patent: Etching method and etching apparatus