Title:
基板上に導電性ナノ粒子を塗布するための装置
Document Type and Number:
Japanese Patent JP6596434
Kind Code:
B2
Abstract:
An arrangement for applying metal nanoparticles onto a wafer or another substrate, is characterized by a metal or semiconductor part arranged in a liquid reservoir, laser or particle emitter for removing nanoparticles from the metal or semiconductor part in the liquid inside the liquid reservoir, and means for applying the removed metal particle containing liquid onto the substrate.
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Inventors:
Atsdust, Mohammad Hossain
Application Number:
JP2016548189A
Publication Date:
October 23, 2019
Filing Date:
January 28, 2015
Export Citation:
Assignee:
Pack Tech-Packaging Technologies GM Behr
International Classes:
B05C5/00; B05C11/10; B22F9/04; B82Y30/00; B82Y40/00
Domestic Patent References:
| JP2013519505A | ||||
| JP2006054212A | ||||
| JP2006122845A | ||||
| JP2009525891A |
Foreign References:
| US20070029185 |
Attorney, Agent or Firm:
Fukami patent office