Title:
A manufacturing method and a semiconductor device for electric power of the semiconductor device embedded device for electric power
Document Type and Number:
Japanese Patent JP6157584
Kind Code:
B2
Abstract:
This invention is provided with: a circuit board(5) which is placed in a package (2) and in which an electric circuit including a power semiconductor element (6) is formed; and a plurality of press-fit terminals (3) each having a wire-bond portion(35) electrically connected in the package (2) to the electric circuit, a press-fit portion (32) for making electrical connection with an apparatus to be connected, and a body portion (33) whose one end portion continuous to the wire bond portion (35) is internally fastened to the package (2) and whose other end portion supports the press-fit portion (32) so as to place the press-fit portion away from the package (2); wherein in each of the plurality of press-fit terminals (3), at a portion in the body portion (33) exposed from the package (2), there is formed a constriction portion (36) that is constricted from both sides in a direction perpendicular to the center line, so as to leave a portion around the center line.
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Inventors:
Minoru Egusa
Kaoru Shige
Kaoru Shige
Application Number:
JP2015502853A
Publication Date:
July 05, 2017
Filing Date:
February 13, 2014
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2013004239A | ||||
| JP2011165836A | ||||
| JP2012529731A | ||||
| JP2012151063A | ||||
| JP2008098585A | ||||
| JP2004022705A | ||||
| JP11097598A |
Foreign References:
| WO2011125747A1 |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa