Title:
基板上の導電性材料を電気化学的に研磨する方法
Document Type and Number:
Japanese Patent JP2009527129
Kind Code:
A
Abstract:
Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.
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Inventors:
Du, Chumbo
Liu, Feng, Cue.
Duboust, Align
Sue, Way-Yang
Chen, Liang-you
Liu, Feng, Cue.
Duboust, Align
Sue, Way-Yang
Chen, Liang-you
Application Number:
JP2008555433A
Publication Date:
July 23, 2009
Filing Date:
January 31, 2007
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/304; B24B37/04; C25F3/16; C25F7/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Ikeda adult
Yuichi Yamada
Ikeda adult