Title:
SEMICONDUCTOR DEVICE, LAMINATE SEMICONDUCTOR DEVICE, LAMINATE SEMICONDUCTOR DEVICE AFTER ENCAPSULATION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2017002279
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having easiness of mounting on a wiring board and laminating a semiconductor device.SOLUTION: There is provided a semiconductor device having a first photosensitive insulation layer formed on a semiconductor element and a second photosensitive insulation layer formed on the first photosensitive insulation layer, where the first photosensitive insulation layer and the second photosensitive insulation layer are formed by a photocurable resin composition containing a silicone polymer compound having repeating units represented by the following formulae (1) and (2), an optical acid generator, a solvent and a crosslinking agent.SELECTED DRAWING: None
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Inventors:
SOGA KYOKO
ASAI SATOSHI
TAKEMURA KATSUYA
ASAI SATOSHI
TAKEMURA KATSUYA
Application Number:
JP2016095863A
Publication Date:
January 05, 2017
Filing Date:
May 12, 2016
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/32; C08G77/48; G03F7/004; G03F7/075; G03F7/40; H01L21/3205; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2013140338A | 2013-07-18 | |||
| JP2015050365A | 2015-03-16 | |||
| JP2011145664A | 2011-07-28 | |||
| JP2013122479A | 2013-06-20 | |||
| JP2014086598A | 2014-05-12 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi