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Title:
ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/153904
Kind Code:
A1
Abstract:
This adhesive composition contains a block copolymer, and an adhesive layer formed using the same has a Young's modulus at 23°C of 0.1 GPa or greater, a storage elastic modulus (G') at 220°C of 1.5×105 Pa or lower, and a loss factor (tanσ) at 220°C of 1.3 or lower.

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Inventors:
TAMURA KOKI (JP)
IMAI HIROFUMI (JP)
OGATA TOSHIYUKI (JP)
KUBO ATSUSHI (JP)
YOSHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2013/057208
Publication Date:
October 17, 2013
Filing Date:
March 14, 2013
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C09J153/00; C09J5/00; C09J7/20; C09J153/02; H01L21/304
Domestic Patent References:
WO2008029569A12008-03-13
Foreign References:
JP2006188646A2006-07-20
JP2005191296A2005-07-14
JP2012036269A2012-02-23
JPH11343469A1999-12-14
Other References:
See also references of EP 2837668A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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