Title:
ADHESIVE COMPOSITION AND VACUUM FORMATION FILM
Document Type and Number:
WIPO Patent Application WO/2023/190638
Kind Code:
A1
Abstract:
Provided is an adhesive sheet for vacuum formation processing, suitable for shaping vacuum formation film which has excellent mechanical strength and tends not to generate foaming, peeling, and adhesive portion defects when subjected to vacuum formation. Also provided is a vacuum-formed film comprising the adhesive sheet. The present invention is an adhesive sheet for vacuum formation processing, the adhesive sheet comprising an adhesive layer containing a cured product of an adhesive composition. The adhesive layer has a storage modulus G' (120) at 120°C of 0.09 MPa-0.50 MPa and a gel fraction of 75% or more.
Inventors:
YASUDA NAOTO (JP)
SUGIMOTO YURIKO (JP)
KASHIMA NOBUYUKI (JP)
NISHIDA MASAKI (JP)
SUGIMOTO YURIKO (JP)
KASHIMA NOBUYUKI (JP)
NISHIDA MASAKI (JP)
Application Number:
PCT/JP2023/012729
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
C08J7/043; C09J7/38; C09J7/22; C09J11/06; C09J133/00
Domestic Patent References:
| WO2018190355A1 | 2018-10-18 | |||
| WO2022064809A1 | 2022-03-31 |
Foreign References:
| JP2019073640A | 2019-05-16 | |||
| JP2021142708A | 2021-09-24 | |||
| JP2019112574A | 2019-07-11 | |||
| JP2022007594A | 2022-01-13 | |||
| JP2022184630A | 2022-12-13 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Download PDF:
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