Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/199269
Kind Code:
A1
Abstract:
This adhesive composition contains: a polymerizable monomer (A); and a block copolymer (B) comprising a polymer block (a) containing a structural unit derived from a styrene compound and a structural unit derived from a maleimide compound, and an acrylic polymer block (b). The polymer block (a) has a solubility parameter of 10.0 or greater. The acrylic polymer block (b) has a solubility parameter of 9.0 or greater. The polymer block (a) comprises 30-99 mass% of the maleimide compound with respect to the total mass of the polymer block (a). The polymer block (a) has a glass transition temperature of 150°C or higher. The acrylic polymer block (b) has a glass transition temperature of 20°C or less.
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Inventors:
ANDOU MASARU (JP)
ANDOU YUUSHI (JP)
SHIBATA AKITSUGU (JP)
KAAI MICHIHIRO (JP)
ANDOU YUUSHI (JP)
SHIBATA AKITSUGU (JP)
KAAI MICHIHIRO (JP)
Application Number:
PCT/JP2018/017090
Publication Date:
November 01, 2018
Filing Date:
April 26, 2018
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J153/00; C09J4/02; C09J4/04
Domestic Patent References:
| WO2017073287A1 | 2017-05-04 |
Foreign References:
| JPS5974176A | 1984-04-26 | |||
| JPS61113609A | 1986-05-31 | |||
| JPH02255855A | 1990-10-16 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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