Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2022/191154
Kind Code:
A1
Abstract:
[Problem] To provide adhesive tape configured such that pinhole formation is suppressed even if the substrate is thinned and that tends not to crack as a result of binding work performed under an environment of a low-temperature of -30℃ or lower. [Solution] This adhesive tape is provided with a substrate layer and an adhesive agent layer disposed on at least one surface of the substrate layer, wherein the substrate layer is formed from a resin composition that contains a polyvinyl chloride resin and 40 to 70 parts by mass of a plasticizer and 1 to 10 parts by mass of an acrylic resin per 100 parts by mass of the polyvinyl chloride resin and that has a melt rupture tensile strength at 180°C of 0.02 to 0.10 N.
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Inventors:
ITO TATSUYA (JP)
YOSHIMURA DAISUKE (JP)
YOSHIMURA DAISUKE (JP)
Application Number:
PCT/JP2022/009837
Publication Date:
September 15, 2022
Filing Date:
March 08, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/00; B32B27/22; C09J7/24; C09J7/38
Foreign References:
| JPH01282286A | 1989-11-14 | |||
| JP2017119806A | 2017-07-06 | |||
| JP2021046532A | 2021-03-25 | |||
| JPS4418080B1 | 1969-08-08 | |||
| JPH10100341A | 1998-04-21 | |||
| JPH10316774A | 1998-12-02 | |||
| JP2003335911A | 2003-11-28 | |||
| JP2021130742A | 2021-09-09 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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