Title:
ALKALI-DISPERSIBLE HOT MELT PRESSURE-SENSITIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2021/117847
Kind Code:
A1
Abstract:
The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain a label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the component (C) comprises (C1) a fatty acid derivative having a melting point of 40 °C or more.
Inventors:
TAKAMORI AI (JP)
Application Number:
PCT/JP2020/046205
Publication Date:
June 17, 2021
Filing Date:
December 11, 2020
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J11/06; C09J11/08; C09J153/02
Domestic Patent References:
| WO2016002548A1 | 2016-01-07 | |||
| WO2016132704A1 | 2016-08-25 |
Foreign References:
| JP2016060847A | 2016-04-25 | |||
| US20100193127A1 | 2010-08-05 | |||
| EP1125980A1 | 2001-08-22 | |||
| JP2017145425A | 2017-08-24 |
Other References:
See also references of EP 4073191A4
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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