Title:
AMIDO-CONTAINING POLYMER COMPOUND AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/118249
Kind Code:
A1
Abstract:
[PROBLEMS] To provide an amido-containing polymer compound that exhibits peculiar thermal response performance, such as large hysteresis during temperature rise and temperature drop steps. [MEANS FOR SOLVING PROBLEMS] There is provided an amido-containing polymer compound of the general formula: (1) wherein each of R1 and R2 is a C1-C10 alkyl; and n is an integer of ≥ 2. This amido-containing polymer compound is a novel compound having two amido groups in each molecule and is characterized by exhibiting peculiar thermal response performance, such as large hysteresis during temperature rise and temperature drop steps (large difference between phase transition temperature during heating and phase transition temperature during cooling).
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Inventors:
MORI TAKESHI (JP)
MINAGAWA KEIJI (JP)
BEPPU SUGURU (JP)
MINAGAWA KEIJI (JP)
BEPPU SUGURU (JP)
Application Number:
PCT/JP2006/308986
Publication Date:
November 09, 2006
Filing Date:
April 28, 2006
Export Citation:
Assignee:
UNIV TOKUSHIMA (JP)
MORI TAKESHI (JP)
MINAGAWA KEIJI (JP)
BEPPU SUGURU (JP)
MORI TAKESHI (JP)
MINAGAWA KEIJI (JP)
BEPPU SUGURU (JP)
International Classes:
C08F22/38
Foreign References:
| JP2005068353A | 2005-03-17 | |||
| JPH07285828A | 1995-10-31 | |||
| JP2000344835A | 2000-12-12 |
Attorney, Agent or Firm:
Toyosu, Yasushi (Kanazawa Tokushima-shi, Tokushima 71, JP)
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