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Patent Searching and Data


Title:
ANGULAR VELOCITY SENSOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/119609
Kind Code:
A1
Abstract:
One or more diaphragm layers (21, 22) that constitute a diaphragm part (12) are formed by a thin film forming technique. When the resonance frequency in a resonance vibration mode calculated from the dimensions of a structure of an angular velocity sensor (10) and the elastic parameter of a material therefor is defined as f [kHz], the mass of a weight part (14) is defined as M [mg], the circumference of the diaphragm part (12) is defined as r [m], the stress applied to a piezoelectric layer (32) is defined as σp [Pa], the thickness thereof is defined as tp [m], the stress applied to an n-th layer from the side of the weight part (14) in a diaphragm portion composed of a plurality of layers including a lower electrode and the diaphragm layers (21, 22) is defined as σn [Pa], and the thickness thereof is defined as tn [m] (n is a natural number), Teff expressed by Teff=r(σptp+Σσntn)/M satisfies {(-0.36f2+210)/33}≤Teff≤{(0.44f2+210)/33}.

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Inventors:
NAONO TAKAYUKI (JP)
NAKANO TAKUMA (JP)
Application Number:
PCT/JP2014/051929
Publication Date:
August 07, 2014
Filing Date:
January 29, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G01C19/5783
Foreign References:
US20120043855A12012-02-23
JP2010145122A2010-07-01
JP2006153481A2006-06-15
JP2005345245A2005-12-15
JP2010160095A2010-07-22
JPH0412232B21992-03-03
Other References:
See also references of EP 2952853A4
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
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