Title:
BOILING-TYPE COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/042880
Kind Code:
A1
Abstract:
A boiling-type cooling device (100) comprises: a boiling unit (10) which includes an accommodation space (11) for accommodating a refrigerant (1), a refrigerant gas exit (12), and a refrigerant liquid entrance (13); and a compression unit (20) which includes a refrigerant channel (21) and an external channel (22). The boiling unit includes: a first wall (14) to which an exothermic body (HS) is attached; a second wall (15) that opposes the first wall with the accommodation space interposed therebetween, and that is adjacent to the external channel; and thermally conductive parts (19) that pass through the accommodation space and connect the first wall and the second wall.
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Inventors:
TANABE AKIHIRO (JP)
YAMANAKA KIYOAKI (JP)
ANDO KENJI (JP)
YAMANAKA KIYOAKI (JP)
ANDO KENJI (JP)
Application Number:
PCT/JP2022/034557
Publication Date:
March 23, 2023
Filing Date:
September 15, 2022
Export Citation:
Assignee:
SUMITOMO PRECISION PROD CO (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Foreign References:
| JP2002164486A | 2002-06-07 | |||
| JP2001068611A | 2001-03-16 | |||
| JP2005268658A | 2005-09-29 | |||
| JP2019046965A | 2019-03-22 | |||
| US4705102A | 1987-11-10 | |||
| JP2004241580A | 2004-08-26 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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