Title:
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/224949
Kind Code:
A1
Abstract:
This copper/ceramic bonded body is obtained by bonding a copper members (12), (13) to one surface and the other surface of a ceramic member (11), respectively, wherein, at the bonding interfaces of the ceramic member (11) and the copper members (12), (13), the maximum value of the indentation hardness of regions of 10 μm to 50 μm from the bonding interfaces of active metal compound layers (21), (31) with the copper members (12), (13) to the sides of the copper members (12), (13) is in a range of 120 mgf/μm2 to 200 mgf/μm2, and the difference between the maximum value H1 of the indentation hardness in the copper member (12) bonded to the one surface and the maximum value H2 of the indentation hardness in the copper member (13) bonded to the other surface is 50 mgf/μm2 or less.
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Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/018135
Publication Date:
October 27, 2022
Filing Date:
April 19, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K1/19; C04B37/02; H01L23/13; H01L23/36; H05K3/38
Domestic Patent References:
| WO2018021472A1 | 2018-02-01 | |||
| WO2021033421A1 | 2021-02-25 | |||
| WO2017056360A1 | 2017-04-06 | |||
| WO2021124923A1 | 2021-06-24 |
Foreign References:
| JP2014090144A | 2014-05-15 | |||
| JP2018008869A | 2018-01-18 | |||
| JP2019033131A | 2019-02-28 | |||
| JP2004207587A | 2004-07-22 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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