Title:
COPPER/CERAMIC BONDED BODY, INSULATION CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/044590
Kind Code:
A1
Abstract:
This copper/ceramic bonded body is formed by bonding a copper member (22) composed of copper or copper alloy to a ceramic member (11) composed of aluminum oxide, wherein a magnesium oxide layer (31) is formed on the ceramic member (11) side, between the copper member (22) and the ceramic member (11), and an Mg solid solution layer (32), in which Mg is dissolved in a parent phase of Cu, is formed between the magnesium oxide layer (31) and the copper member (22).
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Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2019/003834
Publication Date:
March 05, 2020
Filing Date:
February 04, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B23K20/00; H05K1/03
Domestic Patent References:
| WO2017077761A1 | 2017-05-11 |
Foreign References:
| JP2015224151A | 2015-12-14 | |||
| JP2012129548A | 2012-07-05 | |||
| JPH02307875A | 1990-12-21 | |||
| JP2018032732A | 2018-03-01 | |||
| JPH03112874A | 1991-05-14 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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