Title:
BONDING WIRE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112444
Kind Code:
A1
Abstract:
This bonding wire contains 0.005-2.0 mass% of In, a total of 0.005-2.0 mass% one or both of Au and Pd, a total of 5-500 ppm by mass of one or both elements selected from Bi and Cu, and a total of 0-500 ppm by mass of one or more elements selected from the group consisting of Ca, Mg, Ge, Y, Nd, Sm, Gd, La and Ce, with the remainder comprising Ag. Due to this configuration, it is possible to achieve excellent long-term reliability and achieve a good circular shape when a FAB is brought into contact with an electrode and crushed.
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Inventors:
TAKIGAWA TAMAMI (JP)
TANAHASHI AKIRA (JP)
TANAHASHI AKIRA (JP)
Application Number:
PCT/JP2022/037712
Publication Date:
June 22, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01L21/60; C22C5/06
Domestic Patent References:
| WO2021100583A1 | 2021-05-27 | |||
| WO2016098707A1 | 2016-06-23 | |||
| WO2016006326A1 | 2016-01-14 | |||
| WO2017187653A1 | 2017-11-02 |
Attorney, Agent or Firm:
TSUTADA & CO. (JP)
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