Title:
BRAZING DEVICE AND METHOD FOR BRAZING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/048642
Kind Code:
A1
Abstract:
This brazing device (100) comprises: a stage (10) that supports an assembly (AS) in which a brazing material (120) is interposed between bonding surfaces (130) of a plurality of members to be bonded (110); a pressing jig (20) that presses the assembly toward the stage; a heating unit (30) that heats the brazing material to a predetermined temperature for melting the same; and a vibration application unit (40) that applies ultrasonic vibrations. The vibration application unit is configured to cause the stage and the pressing jig to vibrate relative to each other in a state in which the assembly being pressed is heated to the predetermined temperature, so as to remove an oxide film on the bonding surfaces of the plurality of members to be bonded.
Inventors:
SASAKI TOMOHIRO (JP)
UEDA TATSUYA (JP)
SUEDA KOKI (JP)
UEDA TATSUYA (JP)
SUEDA KOKI (JP)
Application Number:
PCT/JP2023/031477
Publication Date:
March 07, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
UNIV NIIGATA (JP)
SUMITOMO PRECISION PROD CO (JP)
SUMITOMO PRECISION PROD CO (JP)
International Classes:
B23K1/008; B23K1/06
Foreign References:
JPS4991060A | 1974-08-30 | |||
JPH03146294A | 1991-06-21 | |||
JPH0569120A | 1993-03-23 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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