BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREFOR, FILTER AND ELECTRONIC DEVICE

Title:

BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREFOR, FILTER AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/001860

Kind Code:

A1

Abstract:

The present disclosure relates to a bulk acoustic wave resonator comprising a substrate, an acoustic mirror, a bottom electrode, a top electrode and a piezoelectric layer, wherein an overlapped area of the acoustic mirror, the bottom electrode, the piezoelectric layer and the top electrode in the thickness direction of the resonator forms an effective area of the resonator. A conductive layer is also arranged on the upper side of the top electrode and surrounding the edge of the effective area, and is electrically connected to the top electrode. A gap is provided between at least a portion of the bottom surface of the inner end and/or the outer end of the conductive layer and the upper surface of the top electrode to form a suspension structure. The present disclosure also relates to a method for manufacturing the bulk acoustic wave resonator, a filter, and an electronic device.

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Inventors:

PANG WEI (CN)
HAO LONG (CN)
XU YANG (CN)
MA XIAODAN (CN)
HUANG YUANQING (CN)
YANG QINGRUI (CN)

Application Number:

PCT/CN2021/102307

Publication Date:

January 06, 2022

Filing Date:

June 25, 2021

Export Citation:

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Assignee:

ROFS MICROSYSTEM TIANJIN CO LTD (CN)

International Classes:

H03H3/02; H03H9/17; H03H9/02; H03H9/54

Foreign References:

US20080042780A1	2008-02-21
CN111245396A	2020-06-05
CN111010123A	2020-04-14
CN111193482A	2020-05-22
CN111030636A	2020-04-17
US5587620A	1996-12-24
CN111245394A	2020-06-05
JP2006019935A	2006-01-19

Other References: