Title:
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/108290
Kind Code:
A1
Abstract:
A method is provided for forming a bump (19) on an electrode (32) on a wiring board
(31). On a wiring board (31), in a first region (17) including the electrode (32),
a fluid (14) containing conductive particles (16) and a bubble generating agent
is applied. Then, on a main plane (18) of a board (40) having an area larger than
that of the first region (17), a board (40) whereupon a protruding plane (13) having
an area equivalent to that of the first region (17) is arranged by having the protruding
plane (13) face the first region (17) of the wiring board (31). Then, the fluid
(14) is heated, and bubbles (30) are generated from the bubble generating agent
contained in the fluid (14).
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Inventors:
TANIGUCHI YASUSHI
NAKATANI SEIICHI
KARASHIMA SEIJI
KITAE TAKASHI
MATSUOKA SUSUMU
KOYAMA MASAYOSHI
NAKATANI SEIICHI
KARASHIMA SEIJI
KITAE TAKASHI
MATSUOKA SUSUMU
KOYAMA MASAYOSHI
Application Number:
PCT/JP2007/053866
Publication Date:
September 27, 2007
Filing Date:
February 22, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
TANIGUCHI YASUSHI
NAKATANI SEIICHI
KARASHIMA SEIJI
KITAE TAKASHI
MATSUOKA SUSUMU
KOYAMA MASAYOSHI
TANIGUCHI YASUSHI
NAKATANI SEIICHI
KARASHIMA SEIJI
KITAE TAKASHI
MATSUOKA SUSUMU
KOYAMA MASAYOSHI
International Classes:
H05K3/34; H01L21/60
Domestic Patent References:
| WO2006025387A1 | 2006-03-09 | |||
| WO2005122237A1 | 2005-12-22 |
Foreign References:
| JP2002223065A | 2002-08-09 | |||
| JP2000094179A | 2000-04-04 | |||
| JPH01157796A | 1989-06-21 | |||
| JPH0774459A | 1995-03-17 | |||
| JP2004257206A | 2004-09-16 | |||
| JP2004365684A | 2004-12-17 | |||
| JP2005094232A | 2005-04-07 |
Other References:
See also references of EP 1996002A4
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (5-7 Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, JP)
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