Title:
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/074470
Kind Code:
A1
Abstract:
A ceramic copper circuit board according to one embodiment of the present invention is provided with: a ceramic substrate; and a copper circuit part that is bonded to at least one surface of the ceramic substrate, with a brazing material layer being interposed therebetween. The brazing material layer contains Cu, Ti, and one or two elements that are selected from among Sn and In. The brazing material layer comprises: a bonding part that is provided between the ceramic substrate and the copper circuit part; and a first protrusion part that is provided around the bonding part, and has a titanium content within the range from 70% by mass to 100% by mass. It is preferable that the sum of the titanium content and the nitrogen content in the first protrusion part is within the range from 99% by mass to 100% by mass.
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Inventors:
KATO HIROMASA (JP)
SANO TAKASHI (JP)
SANO TAKASHI (JP)
Application Number:
PCT/JP2022/038771
Publication Date:
May 04, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA MATERIALS CO LTD (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
H05K1/03; H01L23/13
Domestic Patent References:
| WO2019221174A1 | 2019-11-21 | |||
| WO2020184510A1 | 2020-09-17 | |||
| WO2020183701A1 | 2020-09-17 |
Foreign References:
| JP2003283064A | 2003-10-03 | |||
| JP6158144B2 | 2017-07-05 | |||
| JP2003283064A | 2003-10-03 |
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
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