Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
A CHEMICAL-MECHANICAL POLISHING LIQUID FOR POLYSILICON
Document Type and Number:
WIPO Patent Application WO/2009/070969
Kind Code:
A1
Abstract:
A chemical-mechanical polishing liquid for polysilicon is disclosed, which contains abrasive particles, water and at least one compound having more than two group of [-C(NH)-NH-]. The polishing liquid can improve the removal rate of polysilicon and selection ratio of polysilicon to dielectric material. It has better application foreground in the production field of the wafers of semiconductor and the like.

More Like This:
WO/2004/089816PROCESS FOR THE PRODUCTION OF METAL OXIDE AND METALLOID OXIDE DISPERSIONS
WO/2018/088371POLISHING COMPOSITION AND SILICON WAFER POLISHING METHOD
JP2008252110POLISHING FLUID AND POLISHING METHOD
Inventors:
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
WANG CARL CHEN (CN)
Application Number:
PCT/CN2008/001858
Publication Date:
June 11, 2009
Filing Date:
November 07, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ANJI MICROELECTRONICS SHANGHAI (CN)
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
WANG CARL CHEN (CN)
International Classes:
C09G1/02
Domestic Patent References:
WO2008004320A12008-01-10
Foreign References:
JP2004031443A2004-01-29
JP2004031446A2004-01-29
CN101280158A2008-10-08
US20050282390A12005-12-22
CN1643660A2005-07-20
Attorney, Agent or Firm:
HANHONG LAW FIRM (New Huang Pu Financial BuildingNo. 61 East Nanjing Road, Shanghai 2, CN)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: A CHEMICAL-MECHANICAL POLISHING LIQUID

Next Patent: DEVICE COMPRISING ENDOTRACHEAL CONDUIT INCORPORATING BRONCHIAL BLOCKER FOR ONE-LUNG VENTILATION