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Title:
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/037499
Kind Code:
A1
Abstract:
A circuit board assembly and a manufacturing method therefor. The circuit board assembly comprises: a substrate (10), the substrate (10) comprising a plurality of layers of daughter boards (11) which are stacked, a first conductive layer (12) being provided between every two adjacent layers of daughter boards (11), conductive vias being formed in the daughter boards (11), and the conductive vias being electrically connected to the first conductive layers (12); a first frame structure and a second frame structure being correspondingly provided on two opposite surfaces of the substrate (10), respectively; a first circuit board (30), the first circuit board (30) covering the surface of the side of the first frame structure away from the substrate (10) so as to define a first accommodating cavity; and a second circuit board (40) located on the side of the substrate (10) away from the first circuit board (30), the second circuit board (40) covering the surface of the second frame structure away from the substrate (10) so as to define a second accommodating cavity. The first circuit board (30), the substrate (10), and the second circuit board (40) are electrically connected, and the inner walls of the accommodating cavities can be used for mounting electronic components (81, 82).

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Inventors:
LIU MIAO (CN)
Application Number:
PCT/CN2023/112894
Publication Date:
February 22, 2024
Filing Date:
August 14, 2023
Export Citation:
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Assignee:
VIVO MOBILE COMMUNICATION CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
CN115279022A2022-11-01
CN108235832A2018-06-29
CN104159406A2014-11-19
CN110730561A2020-01-24
CN111698827A2020-09-22
CN112261775A2021-01-22
CN113347788A2021-09-03
CN210670769U2020-06-02
KR100769527B12007-10-23
Attorney, Agent or Firm:
CN-KNOWHOW INTELLECTUAL PROPERTY AGENT LIMITED (CN)
Download PDF:
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