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Patent Searching and Data


Title:
CIRCUIT BOARD, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/000750
Kind Code:
A1
Abstract:
Provided in the present application are a circuit board, an electronic device, and a production method for the circuit board. The circuit board comprises: a board body; an electronic element, which is welded on a surface of the board body by means of soldering; and reaction particles which are arranged on the surface of the board body and are adjacent to a welding pin for welding the electronic element. When the circuit board is charged and in a water environment, the reaction particles react with the welding pin to form an insoluble substance protective layer on an outer surface of the welding pin, such that the insoluble substance protective layer isolates the welding pin from coming into contact with water, so as to prevent dendrite corrosion of the welding pin. In the solution provided in the embodiments of the present application, dendrite corrosion of the circuit board can be prevented, and the arrangement of the reaction particles is not prone to limitation by a geometric shape of the circuit board; therefore, the arrangement process of the reaction particles on the board body is more flexible, simple and easy to operate, such that the production processes of the circuit board and the electronic device are also simple, thereby lowering production costs of the circuit board and the electronic device.

Inventors:
GAO LEIWEN (CN)
Application Number:
PCT/CN2022/089474
Publication Date:
January 26, 2023
Filing Date:
April 27, 2022
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H05K3/28; H05K3/34
Foreign References:
CN113573493A2021-10-29
CN101302615A2008-11-12
CN103531485A2014-01-22
CN103384448A2013-11-06
CN202110821567A2021-07-20
Other References:
See also references of EP 4145965A4
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO.,LTD. (CN)
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