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Title:
CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTION BOX INCLUDING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/195104
Kind Code:
A1
Abstract:
Provided is a circuit board on which an electronic component including a first terminal and a second terminal arranged in parallel is mounted, the circuit board comprising an insulating holding member, an electrically conductive plate, and a signal circuit. The electrically conductive plate is held by the holding member. The first terminal is bonded to the electrically conductive plate. The signal circuit is formed on a surface of the holding member by means of an electrically conductive nano-ink including flux. An end of the signal circuit and the second terminal are bonded together by soldering.

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Inventors:
HARAGUCHI AKIRA (JP)
Application Number:
PCT/JP2020/002773
Publication Date:
October 01, 2020
Filing Date:
January 27, 2020
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L23/12; H02G3/16; H05K3/00; H05K3/10; H05K3/12; H05K3/20; H05K3/34; H05K5/00
Foreign References:
JP2018190767A2018-11-29
JP2013074244A2013-04-22
JP2009070727A2009-04-02
JPH05235243A1993-09-10
JP2006005096A2006-01-05
JP2003164040A2003-06-06
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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