Title:
CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/044382
Kind Code:
A1
Abstract:
A circuit board which comprises a conductor (2) preformed so as to have a certain
pattern and a resin base (3) formed by transferring the conductor to a surface
layer of a thermosetting resin and then curing the thermosetting resin, characterized
in that the surface of the conductor is flush with the surface of the resin base
and the thermosetting resin is in a powdery state. Also provided is a process for
producing the circuit board.
Inventors:
INAGAKI HIROYASU
KAWANISHI NORIYUKI
KAWANISHI NORIYUKI
Application Number:
PCT/JP2007/064485
Publication Date:
April 17, 2008
Filing Date:
July 24, 2007
Export Citation:
Assignee:
MANAC INC (JP)
INAGAKI HIROYASU
KAWANISHI NORIYUKI
INAGAKI HIROYASU
KAWANISHI NORIYUKI
International Classes:
H05K3/20; C08G73/10; H05K1/03; H05K3/00; H05K3/22
Foreign References:
| JPH02139216A | 1990-05-29 | |||
| JP2001144390A | 2001-05-25 | |||
| JPH0481428A | 1992-03-16 | |||
| JP2006114577A | 2006-04-27 | |||
| JP2003103738A | 2003-04-09 |
Attorney, Agent or Firm:
TSUKUNI, Hajime (22-12 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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