Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/093424
Kind Code:
A1
Abstract:
A circuit structure (10) provided with: electronic components (11); a circuit substrate (14) having an electroconductive path, the electronic components (11) being mounted on the circuit substrate (14); a heat dissipation member (24) overlaid onto the circuit substrate (14), the heat dissipation member dissipating heat from the circuit substrate (14); a spacer sheet (20) provided in a predetermined region between the circuit substrate (14) and the heat dissipation member (24); and affixing parts (23) having adhesive properties or cohesive properties, the affixing parts (23) being provided in those regions between the circuit substrate (14) and the heat dissipation member (24) where the spacer sheet (20) is not provided, and the affixing parts (23) affixing the circuit substrate (14) and the heat dissipation member (24) to each other.
More Like This:
Inventors:
CHIN TOU (JP)
Application Number:
PCT/JP2014/083088
Publication Date:
June 25, 2015
Filing Date:
December 15, 2014
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/16; H05K7/20
Foreign References:
| JP2007202367A | 2007-08-09 | |||
| JP2011172413A | 2011-09-01 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
Patent business corporation dawn joint patent firm (JP)
Download PDF: