Title:
COIL SUBSTRATE FOR MOTOR, AND MOTOR
Document Type and Number:
WIPO Patent Application WO/2023/145753
Kind Code:
A1
Abstract:
Provided are a coil substrate for motors with which a motor having stable performance can be obtained and a motor formed by using the coil substrate for motors. The coil substrate for motors is formed by winding a coil substrate N times (N is an integer equal to or larger than 2) in the circumferential direction, the coil substrate comprising a flexible substrate having a first surface and a second surface opposite the first surface; and a plurality of coils formed by first wiring provided on the first surface and second wiring provided on the second surface. The first surface is placed on the inner circumferential side, the second surface is placed on the outer circumferential side, and the N layers, which are formed by winding the coil substrate N times, have a space formed between the M-th layer (M is an integer equal to larger than 1 and smaller than N) and the (M+1)-th layer, the M-th layer and the (M+1)-th layer being counted from the inside.
Inventors:
HIRASAWA TAKAHISA (JP)
FURUNO TAKAYUKI (JP)
FURUNO TAKAYUKI (JP)
Application Number:
PCT/JP2023/002176
Publication Date:
August 03, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
H02K3/26; H01F5/04
Foreign References:
| JP2017070140A | 2017-04-06 | |||
| US20090072651A1 | 2009-03-19 | |||
| JP2013062999A | 2013-04-04 | |||
| JP2011087437A | 2011-04-28 |
Attorney, Agent or Firm:
MORI Norihisa (JP)
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