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Patent Searching and Data


Title:
COMPOSITE COPPER FOIL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2012/132573
Kind Code:
A1
Abstract:
Provided is a composite copper foil that comprises a copper layer having a thickness of at least 5.1 μm and a nickel layer having a thickness of 0.5-3 μm on both surfaces or one surface of an electrolytic copper foil or a rolled copper foil having a thickness of 10-150 μm, and that is characterized by the sheet thickness precision of the copper layer being less than ±5%, and the peel strength being at least 0.5 kg/cm. Provided is a method for producing the composite copper foil, the method being characterized by forming, by means electroplating, a nickel layer (B) having a thickness of 0.5-3 μm on both surfaces or one surface of an electrolytic copper foil or rolled copper foil (A) having a thickness of 10-150 μm, continuing immediately after forming the nickel layer (B) to forming, by means of electroplating, a thin copper layer (C), and further forming, by means of electroplating on the thin copper layer (C) in a non-successive step, a thick copper layer (D). The problem addressed by the present invention is to obtain a composite copper foil suitable for forming an electronic circuit by means of etching and able to increase the join strength of nickel and copper when producing the composite copper foil comprising copper/nickel/copper, and a method for producing the composite copper foil.

Inventors:
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
Application Number:
PCT/JP2012/053103
Publication Date:
October 04, 2012
Filing Date:
February 10, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
International Classes:
C25D7/06; B32B15/01; C23C28/00; C25D1/04; C25D5/12; H05K1/09
Foreign References:
JP2005260250A2005-09-22
JP2007186797A2007-07-26
JP2004169181A2004-06-17
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
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Claims: