COMPOSITE MEMBER, HEAT-RADIATION MEMBER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING COMPOSITE MEMBER

Title:

COMPOSITE MEMBER, HEAT-RADIATION MEMBER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING COMPOSITE MEMBER

Document Type and Number:

WIPO Patent Application WO/2019/138744

Kind Code:

A1

Abstract:

This composite member includes a substrate formed of a composite material which contains metal and nonmetal, the substrate being provided with: a large warpage portion which is provided on one side of the substrate and has a spherical warpage having a curvature radius R; and a small warpage portion which is partially provided on the large warpage portion and has a warpage different in size from the curvature radius R, wherein the curvature radius R is 5000-35000 mm, the thermal conductivity of the substrate is 150 W/m·K or more, and the linear expansion coefficient of the substrate is 10 ppm/K or less.

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Inventors:

IWAYAMA ISAO (JP)
YAMAMOTO TAKEHISA (JP)
KOYAMA SHIGEKI (JP)
INOUE YUTA (JP)

Application Number:

PCT/JP2018/044895

Publication Date:

July 18, 2019

Filing Date:

December 06, 2018

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)

International Classes:

H01L23/36; C22C29/06; H01L23/12; H01L23/373; C22C1/10

Domestic Patent References:

WO2012108073A1	2012-08-16
WO2013002249A1	2013-01-03

Foreign References:

JP2016167548A	2016-09-15
JP2007088045A	2007-04-05
JP2003158229A	2003-05-30
US20080101032A1	2008-05-01
US20130193591A1	2013-08-01
JP2010106362A	2010-05-13
JP2012197496A	2012-10-18