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Title:
COMPOSITION AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2019/229960
Kind Code:
A1
Abstract:
A composition having a low degree of shrinkage in molding is provided. The composition comprises a metallic-element-containing powder and a resin composition, wherein the resin composition comprises an epoxy resin and a compound having a siloxane bond.

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Inventors:
INOUE HIDETOSHI (JP)
OSAKA MASAHIKO (JP)
TAKEUCHI YUMA (JP)
SEKIYA HIROKI (JP)
YAMAGUCHI SHOHEI (JP)
TAKEUCHI KAZUMASA (JP)
Application Number:
PCT/JP2018/021053
Publication Date:
December 05, 2019
Filing Date:
May 31, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/08; C08K3/10; C08L83/04; C08L83/10
Foreign References:
JP2010138384A2010-06-24
JP2017112218A2017-06-22
JPH1167513A1999-03-09
JP2010212442A2010-09-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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