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Title:
封止充てん用フィルム状樹脂組成物、それを用いた半導体パッケージ及び半導体装置の製造方法、並びに半導体装置
Document Type and Number:
Japanese Patent JP5299279
Kind Code:
B2
Abstract:
Disclosed is a film-like resin composition for encapsulation filling, which contains (a) a thermoplastic resin, (b) an epoxy resin, (c) a curing agent and (d) a compound having two or more phenolic hydroxy groups.

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Inventors:
Tetsuya Enomoto
Akira Nagai
Kazutaka Honda
Application Number:
JP2009528544A
Publication Date:
September 25, 2013
Filing Date:
December 19, 2008
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/62; C08L63/00; C08L101/00; H01L21/60
Domestic Patent References:
JP2005060584A2005-03-10
JP2000297199A2000-10-24
JPH10120761A1998-05-12
JP2002322457A2002-11-08
JP2007002206A2007-01-11
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu



 
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