CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM

Title:

CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM

Document Type and Number:

WIPO Patent Application WO/2008/047823

Kind Code:

A1

Abstract:

A conductive pattern forming film is provided for forming a conductive pattern on a flexible general plastic substrate by a simple process and for easily forming the conductive pattern by using an apparatus that performs a simple process of pressurization at a low temperature. A conductive pattern forming method and a conductive pattern forming apparatus for such film are also provided. The conductive pattern forming film is provided by arranging on the flexible film substrate a pattern which is formed by applying pressure while heating a conductive paste applied by diffusion of a powdery material or fine particles of a metal or a semiconductor. The conductive pattern forming apparatus is composed of a sample arranging table having a flat placing surface, and a pressurizing driving body movably arranged to the placing surface by facing the surface. The pressurizing driving body has a supporting base composed of a metal flat plate having a metal spherical body on the lower surface.

Inventors:

KAMATA TOSHIHIDE (JP)
YOSHIDA MANABU (JP)

Application Number:

PCT/JP2007/070230

Publication Date:

April 24, 2008

Filing Date:

October 17, 2007

Export Citation:

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Assignee:

NAT INST OF ADVANCED IND SCIEN (JP)
KAMATA TOSHIHIDE (JP)
YOSHIDA MANABU (JP)

International Classes:

H01B5/14; H01B13/00

Foreign References:

JP2001064547A	2001-03-13
JP2006024485A	2006-01-26
JP2001243836A	2001-09-07
JP2005259848A	2005-09-22
JP2004273205A	2004-09-30
JP2006517606A	2006-07-27
GB869295A	1961-05-31

Other References: