Title:
CONTINUOUS HOT-DIP METAL PLATING METHOD AND CONTINUOUS HOT-DIP METAL PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/170720
Kind Code:
A1
Abstract:
A continuous hot-dip metal plating method is provided with which it is possible to inhibit both non-plating attributable to metal vapor generated inside the snout and non-plating attributable to an oxide film on the molten-metal-bath surface inside the snout and to stably and rapidly change the oxidizing ability of the atmosphere inside the snout.
The continuous hot-dip metal plating method according to the present invention is characterized by supplying an oxidizing gas to the inside of a snout 14, regulating the temperature of the inner wall of the snout to a temperature not lower than (plating bath temperature)-150°C, and regulating the temperature of the upper atmosphere inside the snout to a temperature not lower than (plating bath temperature)-100°C.
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| JPH0335872 | SOLDERING MACHINE |
Inventors:
TAKAHASHI HIDEYUKI (JP)
Application Number:
PCT/JP2016/001013
Publication Date:
October 27, 2016
Filing Date:
February 25, 2016
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
C23C2/00; C21D9/46; C21D9/56; C23C2/06; C23C2/40
Foreign References:
| JPH11286762A | 1999-10-19 | |||
| JPH0925550A | 1997-01-28 | |||
| JP2002327256A | 2002-11-15 | |||
| JP2014043633A | 2014-03-13 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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