Title:
COPPER ALLOY MATERIAL FOR HEAT-RADIATING COMPONENTS, AND HEAT-RADIATING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/014429
Kind Code:
A1
Abstract:
Provided is a copper alloy material for heat-radiating components which, even after being subjected to a thermal history at high temperatures as a result of bonding such as brazing or welding, is capable of maintaining the rigidity of the copper alloy sheet material itself, which exhibits improved rigidity compared to pure copper alloy sheet materials, and also stably maintaining high thermal transport properties of the obtained heat-radiating component over the long term. This copper alloy material for heat-radiating components has an alloy composition which contains Mn in the amount of 3.00-18.00 mass%, inclusive, with the remainder comprising Cu and inevitable impurities. The Vickers hardness (HV1) thereof is 80 or higher.
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Inventors:
KAWATA SHINGO (JP)
HIGUCHI MASARU (JP)
HIGUCHI MASARU (JP)
Application Number:
PCT/JP2023/025443
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/05; C22F1/00; C22F1/08; F28D15/02
Domestic Patent References:
| WO2018131373A1 | 2018-07-19 | |||
| WO2017056842A1 | 2017-04-06 | |||
| WO2013047199A1 | 2013-04-04 |
Foreign References:
| JP6961861B1 | 2021-11-05 | |||
| JP2016069724A | 2016-05-09 | |||
| JPS557946A | 1980-01-21 | |||
| JP2018059132A | 2018-04-12 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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