Title:
COPPER ALLOY PARTICLES, SURFACE-COATED COPPER-BASED PARTICLES AND MIXED PARTICLES
Document Type and Number:
WIPO Patent Application WO/2018/199110
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide copper alloy particles and the like, wherein, by sufficiently melting the irradiation region with heat generated through the irradiation of a laser beam during molding in particular, a laminated molded product can be obtained which exhibits a low porosity (void fraction), and moreover has superior corrosion resistance and fatigue characteristics. These copper alloy particles 1 are used as a laminated molded material obtained by irradiation with a laser beam having a wavelength of 1.2 μm or less, and has an average particle diameter of 50 μm or less, wherein the light absorption rate of the material is 6% or more.
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Inventors:
YOSHIDA HIROKAZU (JP)
Application Number:
PCT/JP2018/016671
Publication Date:
November 01, 2018
Filing Date:
April 24, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B22F1/05; B22F1/16; B22F1/17
Foreign References:
JP2016211062A | 2016-12-15 | |||
JP2008028286A | 2008-02-07 | |||
JP2003340924A | 2003-12-02 | |||
JPH04131341A | 1992-05-06 | |||
JPS6030186B2 | 1985-07-15 | |||
JP2016053198A | 2016-04-14 | |||
JPS5943963B2 | 1984-10-25 |
Other References:
JOURNAL OF JAPAN WELDING SOCIETY, vol. 78th, no. 2, 2009, pages 124 - 138
See also references of EP 3628417A4
See also references of EP 3628417A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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