Title:
COPPER FINE PARTICLE DISPERSION
Document Type and Number:
WIPO Patent Application WO/2023/013034
Kind Code:
A1
Abstract:
The present invention relates to a copper fine particle dispersion which comprises a dispersion medium C and copper nanoparticles A that are dispersed by a polymer B, wherein: the polymer B comprises a constituent unit derived from a monomer (b-1) that has a carboxy group and a constituent unit derived from a monomer (b-2) that has a polyalkylene glycol segment; the content of the polyalkylene glycol segment in the polymer B is from 55% by mass to 97% by mass; the polymer B has an acid value of 20 mgKOH/g to 250 mgKOH/g; and the dispersion medium C contains at least one substance that is selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerol, and a glycerol derivative. The present invention also relates to a method for producing a bonded body, the method comprising a step in which the copper fine particle dispersion is interposed and heated between a plurality of metal members.
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Inventors:
EYAMA TAKAAKI (JP)
TAKIGUCHI OSAMU (JP)
YOSHIDA TOMOHIDE (JP)
TAKIGUCHI OSAMU (JP)
YOSHIDA TOMOHIDE (JP)
Application Number:
PCT/JP2021/029312
Publication Date:
February 09, 2023
Filing Date:
August 06, 2021
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B22F9/00; C09J9/02
Foreign References:
| JP2020105624A | 2020-07-09 | |||
| JP2014111800A | 2014-06-19 | |||
| JP2010150653A | 2010-07-08 | |||
| JP2018535321A | 2018-11-29 | |||
| JP2020053404A | 2020-04-02 | |||
| JP2013504692A | 2013-02-07 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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