Title:
COPPER FOIL FOR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2006/137240
Kind Code:
A1
Abstract:
This invention provides a copper foil for a printed wiring board, comprising a heat-resistant treatment layer formed on a copper foil in its unroughened surface as a face of bonding to a resin, a chromate film layer provided on the heat-resistant treatment layer, and a silane coupling agent layer provided on the chromate film layer. The copper foil for a printed wiring board is characterized in that, after the silane coupling agent layer formation, the contents of Zn and Cr on the outermost surface of the copper foil is not more than 1.5 atomic% and 3.0 to 12.0 atomic%, respectively. The copper foil for a printed wiring board has excellent chemical resistance, adhesion and high frequency properties.
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Inventors:
AKASE FUMIAKI (JP)
Application Number:
PCT/JP2006/310527
Publication Date:
December 28, 2006
Filing Date:
May 26, 2006
Export Citation:
Assignee:
NIPPON MINING CO (JP)
AKASE FUMIAKI (JP)
AKASE FUMIAKI (JP)
International Classes:
C23C28/00; C23C22/24; C23C22/83; C25D7/00; C25D11/38; H05K1/09
Foreign References:
| JP2003201585A | 2003-07-18 | |||
| JPH0974273A | 1997-03-18 | |||
| JP2003124589A | 2003-04-25 | |||
| JPH04274389A | 1992-09-30 | |||
| JPH0441696A | 1992-02-12 | |||
| JPH03122298A | 1991-05-24 | |||
| JPH03291987A | 1991-12-24 | |||
| JPS5135711B1 | 1976-10-04 | |||
| JPS546701B1 | 1979-03-30 | |||
| JP3306404B2 | 2002-07-24 | |||
| JP2002170827A | 2002-06-14 |
Other References:
See also references of EP 1895024A4
Attorney, Agent or Firm:
Ogoshi, Isamu (Daini-Toranomon Denki Bldg. 5F, 3-1-10 Toranomo, Minato-ku Tokyo 01, JP)
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