Title:
COPPER FOIL WITH CARRIER ATTACHED THERETO
Document Type and Number:
WIPO Patent Application WO/2014/024994
Kind Code:
A1
Abstract:
Provided is a copper foil with a carrier attached thereto, wherein the adhesive force between the carrier and an ultrathin copper layer is high before a step consisting of lamination to an insulating substrate but decreases after said step, allowing easy separation at the interface between the carrier and the ultrathin copper layer and effectively inhibiting the formation of pinholes in the ultrathin-copper-layer-side surface. An intermediate layer comprises nickel and either molybdenum, cobalt, or a molybdenum-cobalt alloy layered in that order on top of the copper-foil carrier. The amount of nickel in the intermediate layer is 1,000-40,000 µg/dm2. If the intermediate layer contains molybdenum, the amount thereof is 50-1,000 µg/dm2, and if the intermediate layer contains cobalt, the amount thereof is 50-1,000 µg/dm2. When separation is performed between the intermediate layer and the ultrathin copper layer, ∫i(x)dx/(∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx+ ∫k(x)dx+ ∫l(x)dx+ ∫m(x)dx) or ∫j(x)dx/(∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx+ ∫k(x)dx+ ∫l(x)dx+ ∫m(x)dx) is between 20% and 80% over the interval [0.0, 4.0] in the depth direction from the surface of the intermediate layer and ∫g(x)dx/(∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx+ ∫k(x)dx+ ∫l(x)dx+ ∫m(x)dx) is at least 40% over the interval [4.0, 12.0].
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Inventors:
HONDA MISATO (JP)
NAGAURA TOMOTA (JP)
NAGAURA TOMOTA (JP)
Application Number:
PCT/JP2013/071558
Publication Date:
February 13, 2014
Filing Date:
August 08, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K1/09; C22C19/07; C22C27/04; C23C28/00; C25D1/04; C25D1/22; C25D7/06
Domestic Patent References:
WO2012046804A1 | 2012-04-12 |
Foreign References:
JP2007186782A | 2007-07-26 | |||
JP2010258398A | 2010-11-11 | |||
JP2012102407A | 2012-05-31 | |||
JP4659140B2 | 2011-03-30 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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