Title:
CURABLE COMPOSITION FOR INKJET AND AIR CAVITY FORMATION, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/220289
Kind Code:
A1
Abstract:
Provided is a curable composition for an inkjet and air cavity formation from which a cured material layer having a high aspect ratio can be formed, and with which adhesiveness and sealing properties can be enhanced. A curable composition for an inkjet and air cavity formation according to the present invention contains: a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group; and a thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group, wherein the content of the thermosetting compound is at least 5 wt% with respect to 100 wt% of the curable composition for an inkjet and air cavity formation, and when a B-staged product is obtained by irradiating the curable composition for an inkjet and air cavity formation with light having a wavelength of 365 nm so that the illuminance is 2,000 mW/cm2, the viscosity of the B-staged product at 40ºC is 2.5×102 Pa∙s to 3.0×106 Pa∙s.
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Inventors:
FUJITA YUSUKE (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
SUGISAWA YOSHIFUMI (JP)
TANAKA TOMOYA (JP)
INOUE TAKANORI (JP)
HAMADA TAICHI (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
SUGISAWA YOSHIFUMI (JP)
TANAKA TOMOYA (JP)
INOUE TAKANORI (JP)
HAMADA TAICHI (JP)
Application Number:
PCT/JP2022/017861
Publication Date:
October 20, 2022
Filing Date:
April 14, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B41M5/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2014050688A1 | 2014-04-03 |
Foreign References:
| JP2018067676A | 2018-04-26 | |||
| JP2014237814A | 2014-12-18 | |||
| JP2018074566A | 2018-05-10 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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