CURABLE COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, AND DISPLAY DEVICE

WIPO Patent Application WO/2015/076160

A1

Provided are: a curable composition which can achieve high hardness even when heated at a low temperature; a method for producing a cured film using the curable composition; a cured film; and an organic EL display device and a liquid crystal display device each produced using a cured film. A curable composition comprising (I) an acrylic resin having an epoxy group and/or a styrene resin having an epoxy group, (J) a compound having a carboxyl group and having a weight average molecular weight of 1000 to 50,000 (wherein a compound corresponding to the component (I) is excluded), (C) an alkoxysilane compound, (D) an organic solvent and (E) inorganic particles having an average particle diameter of 1 to 200 nm and/or polymer particles having an average particle diameter of 1 to 200 nm. In the curable composition, the average porosity which is an arithmetic average value of area ratios determined with respect to 200 particles selected from the inorganic particles and the polymer particles is less than 10%, wherein each of the area ratios is the ratio of the area of a void part to the area of a particle cross section in a cross sectional image of each of the particles as observed on an electron microscope. When the curable composition is cured to produce a film, the total light transmittance of the film as measured in accordance with JIS-K-7136 is 90% or more.

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JP2016160420	THERMOSETTING COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, ELECTRONIC COMPONENT, AND DISPLAY DEVICE
JPS607158	[Title of the Invention] A joint for gas piping

YAMAZAKI KENTA (JP)
YONEZAWA HIROYUKI (JP)

PCT/JP2014/079920

May 28, 2015

November 12, 2014

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FUJIFILM CORP (JP)

C08G59/42; C08G18/58; C08K5/29; C08K5/37; C08K5/5415; C08K7/16; C08L63/00; C08L101/08; G02F1/1333

WO2005035654A1

2005-04-21

JP2007094164A	2007-04-12
JP2007079527A	2007-03-29
JP2006276048A	2006-10-12
JP2007271994A	2007-10-18

SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)

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