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Title:
CURABLE MATERIAL AND METHOD FOR MOLDING SAID THERMALLY CURABLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/004470
Kind Code:
A1
Abstract:
The present invention provides a thermally curable material which comprises ingredients (A) to (C) and which, when examined with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), has a viscosity of 5-200 Pa∙s at 25°C and 10 s-1 and has a viscosity of 0.3-50 Pa∙s at 25°C and a shear rate of 100 s-1. Ingredient (A) is a (meth)acrylate compound which includes an (un)substituted C6 or higher alicyclic hydrocarbon group bonded by ester linkage and which, when examined with a rotational viscometer at a constant shear rate, has a viscosity of 5-300 mPa∙s at 25°C. Ingredient (B) is spherical silica. Ingredient (C) is a black pigment.

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Inventors:
OBATA YUTAKA (JP)
MORI HARUHIKO (JP)
Application Number:
PCT/JP2018/024960
Publication Date:
January 03, 2019
Filing Date:
June 29, 2018
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08F2/44; B29C45/00; C08F20/18
Domestic Patent References:
WO2016117624A12016-07-28
Foreign References:
JP2016008230A2016-01-18
JP2016222761A2016-12-28
JP2006503160A2006-01-26
JP2013079327A2013-05-02
JP2016224319A2016-12-28
JP2007234767A2007-09-13
JP2003046138A2003-02-14
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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