Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/068109
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition which makes it possible to obtain a cured product having excellent conductivity and curing properties. The present invention is a curable resin composition comprising (A) a cyanate ester resin, (B) an epoxy resin, (C) a latent curing agent that contains an amine-based latent curing agent which is obtained by reacting an amine compound and an epoxy compound and which has an active hydrogen, and (D) a conductive filler. The latent curing agent which is component (C) preferably further contains a phenol resin. The conductive filler which is component (D) is preferably one or more types of filler selected from among silver particles and copper particles.
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Inventors:
OTA KEISUKE (JP)
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
Application Number:
PCT/JP2022/037880
Publication Date:
April 27, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08L63/00; C08G59/50; C08K3/013; C08K3/08; C08L79/00; C09J163/00; C09J179/00
Domestic Patent References:
| WO2021049390A1 | 2021-03-18 | |||
| WO2011099292A1 | 2011-08-18 | |||
| WO2009001658A1 | 2008-12-31 | |||
| WO2022190745A1 | 2022-09-15 |
Foreign References:
| JPH11134940A | 1999-05-21 | |||
| JP2012532942A | 2012-12-20 | |||
| JP2004352785A | 2004-12-16 | |||
| JPH09279121A | 1997-10-28 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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