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Title:
CURABLE RESIN COMPOSITION, INSULATING CURED FILM AND INSULATING CURED FILM FOR TOUCH PANELS EACH PRODUCED BY CURING SAID COMPOSITION, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2024/005189
Kind Code:
A1
Abstract:
Provided is a curable resin composition comprising a thermosetting alkali-soluble resin (A1) having an acid value of 55 to 100 mgKOH, a photocurable alkali-soluble resin (A2) having an acid value of 20 to 100 mgKOH/g, a (meth)acrylic monomer (B1) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, and a silane compound (C) represented by formula (1) or (2). (In the formulae, R1 to R3 may be the same as or different from one another, in which all or at least one of these residues represents an alkoxy groups having 1 to 5 carbon atoms and the other represents an alkyl group having 1 to 5 carbon atoms; R4 to R6 may be the same as or different from one another, and each independently represent an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms; A represents a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, and may contain a bivalent or trivalent linking group; B represents a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms, and may contain a bivalent linking group; X represents O, NH, NH-CO-NH or S; p represents an integer of 0 or 1; q represents an integer of 1 to 3; r represents an integer of 1 to 3; s represents an integer of 1 to 3; and t represents an integer of 1 to 3.)

Inventors:
OOURA YUUKI (JP)
Application Number:
PCT/JP2023/024394
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
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Assignee:
OSAKA ORGANIC CHEMICAL IND LTD (JP)
International Classes:
C08F290/12; G06F3/044
Foreign References:
JP2013164471A2013-08-22
JP2016042127A2016-03-31
JP2015230339A2015-12-21
JP2016103015A2016-06-02
JP2018031940A2018-03-01
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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