Title:
CURED OBJECT, OVERCOAT FILM, AND FLEXIBLE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/005914
Kind Code:
A1
Abstract:
Provided is a cured object highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. When examined by a pulse nuclear magnetic resonance method at a frequency of 20 MHz, the cured object formed from a curable resin composition gives a magnetization-intensity free induction decay signal f(t), which is for determining the spin-spin relaxation time T2 of a proton, and when the free induction decay signal f(t) is approximated by the following numerical expression, then the value of [A(1)×T2(1)+A(2)×T2(2)] calculated from the A(1), A(2), T2(1), and T2(2) contained in the numerical expression is 0.015 ms or less and the value of T2(3) is 0.50 ms or greater.
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Inventors:
ISHIBASHI YOSHITAKA (JP)
MESUDA KOYUKI (JP)
YAMASHITA MIO (JP)
KIMURA KAZUYA (JP)
MESUDA KOYUKI (JP)
YAMASHITA MIO (JP)
KIMURA KAZUYA (JP)
Application Number:
PCT/JP2020/021412
Publication Date:
January 14, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
NIPPON POLYTECH CORP (JP)
International Classes:
C08G59/40; B32B15/092; B32B15/095; C08G18/08; C08G18/42; C08G18/44; C08K3/013; C08L63/00; C08L75/04; C08L101/12; H05K3/28
Domestic Patent References:
| WO2017110591A1 | 2017-06-29 | |||
| WO2017110326A1 | 2017-06-29 | |||
| WO2016017797A1 | 2016-02-04 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS et al. (JP)
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