Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/005915
Kind Code:
A1
Abstract:
This semiconductor device is provided with a semiconductor element (1), a lead frame (30), a crosslinking member (51), and a seal resin (7). The semiconductor device has an exposed first electrode (14) on one surface and an exposed second electrode (12) on a surface opposite to the one surface. The lead frame includes: a mounting part (32) to which the semiconductor element is mounted and to which the first electrode is electrically connected; and a non-mounting part (31) that is divided from the mounting part. The crosslinking member is electrically conductive and electrically connects the second electrode to the non-mounting part. The seal resin is electrically insulative and has a thermal conductivity of not less than 2.2 W, and covers the semiconductor element, the lead frame, and the crosslinking member in a state where an opposite surface (S11) of a mount surface of the mounting part is exposed.
Inventors:
IGOSHI TAROU (JP)
Application Number:
PCT/JP2020/021510
Publication Date:
January 14, 2021
Filing Date:
June 01, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017138092A1 | 2017-08-17 |
Foreign References:
| JP2019075523A | 2019-05-16 | |||
| JP2013016837A | 2013-01-24 | |||
| JP2014082384A | 2014-05-08 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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